LASER: High speed Laser perforation micro-holes and scoring
MOD. SM-LS
Laser perforation is for doing micro-holes into material to allow the release of atmospheric gases from the packaging to extend the shelf life of your products. (MAP) and for doing scoring, scribing in machine direction for easy-open.
Our Laser MOD. SM-LS is a laser scoring in machine direction for flexible film packaging maintaining the integrity of the product inside. (easy-pen melting the top layer). The depth of scoring and penetration into the material being processed can be controlled accurately and Laser focus can be adjusted for the material being processed. Lasers are typically modular and can be mounted on just about any line.
